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PATENT

The company currently has 12 technical patents, including 2 invention patents.

  • 1

    Multilayer nickel plating method for relay shell

  • 2

    Over-welding method of rectifier bridge and its shell, frame and bottom plate

  • 3

    A solid relay shell with a certain angle on the grounding part of the inner lead

  • 4

    Tungsten copper bottom plate solid relay housing capable of resisting high temperature and not easily deforming

  • 5

    Solid relay shell with insulating sheet of divided structure

  • 6

    Solid relay housing with insulating sheet not prone to cracks

  • 7

    High temperature resistant and non-deformable oxygen-free copper bottom plate solid relay housing

  • 8

    Solid relay shell with insulating sheet buried in bottom plate

  • 9

    A solid relay housing provided with multiple nickel-plated layers

  • 10

    Surface-mounted ceramic metal casing for microelectronics packaging

  • 11

    High-tightness lead patch sealing structure

  • 12

    Microelectronic package shell with nickel-plated inside cavity and gold-plated outside

  • 13

    Sealing structure embedded in ceramic

  • 14

    Insulation structure and package shell