The company currently has 12 technical patents, including 2 invention patents.
Multilayer nickel plating method for relay shell
Over-welding method of rectifier bridge and its shell, frame and bottom plate
A solid relay shell with a certain angle on the grounding part of the inner lead
Tungsten copper bottom plate solid relay housing capable of resisting high temperature and not easily deforming
Solid relay shell with insulating sheet of divided structure
Solid relay housing with insulating sheet not prone to cracks
High temperature resistant and non-deformable oxygen-free copper bottom plate solid relay housing
Solid relay shell with insulating sheet buried in bottom plate
A solid relay housing provided with multiple nickel-plated layers
Surface-mounted ceramic metal casing for microelectronics packaging
High-tightness lead patch sealing structure
Microelectronic package shell with nickel-plated inside cavity and gold-plated outside
Sealing structure embedded in ceramic
Insulation structure and package shell