Latest Honor

• Multilayer nickel plating method for relay shell
• Insulation structure and package shell
• Sealing structure embedded in ceramic
• Microelectronic package shell with nickel-plated inside cavity and gold-plated outside
• High-tightness lead patch sealing structure
• Surface-mounted ceramic metal casing for microelectronics packaging
• A solid relay housing provided with multiple nickel-plated layers
• Oxygen-free copper bottom plate solid relay housing capable of resisting high temperature and not easily deforming
• Solid relay shell with insulating sheet buried in bottom plate
• Solid relay housing with insulating sheet not prone to cracks